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CVE-2024-43047

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Description

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services while maintaining memory maps of HLOS memory.

Recommended action

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

CISA remediation due date for U.S. federal agencies: 29 Oct 2024.

Collected automatically from public sources. Verify affected versions and fixes in the vendor's notice before acting.