Description
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
Recommended action
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
CISA remediation due date for U.S. federal agencies: 26 Dec 2023.
Collected automatically from public sources. Verify affected versions and fixes in the vendor's notice before acting.